TSMC provides foundry's most comprehensive CMOS Image Sensor process technology portfolio, featuring superior resolution, faster speed, and lower power consumption.

TSMC's CMOS Image Sensor technology ranges from 0.5-micron (µm) to 28nm nodes and supports a variety of applications, including PC cameras, digital cameras and recorders, digital TVs, toys, security systems, video cameras and other portable devices.

In 2018, TSMC had several achievements in CMOS image sensor technology including: (1) mass-production of new-generation sensors of sub-micron pixel for mobile application; (2) successful development of Ge-on-Si sensor for 3D range sensing applications with performance superior to Si sensor; (3) successful application of wafer stack technology to prototype Single Photon Avalanche Diode (SPAD) sensor array technology for 3D time-of-flight applications.

TSMC provides a comprehensive IoT Platform with ULP technologies to enable low-power and low-leakage applications that have been widely adopted by IC design houses & system companies.

The increasing IoT applications also create scenarios that edge devices and sensors will be operated on batteries, where battery life may influence the usefulness and proliferation of AIoT devices. Innovative Ultra-low Power (ULP) technology is essential to extend battery life while supporting enhanced performance.

AMD, Apple, ARM, Broadcom, Marvell, MediaTek, and Nvidia