Siemens is the largest engineering company in Europe. With their positioning along the electrification value chain, Siemens has the knowhow that extends from power generation to power transmission, power distribution and smart grid to the efficient application of electrical energy. Featured Subsidiaries/ Business Units: - Digital Factory - Siemens Technology to Business (TTB)

Focused at Cloud Computing solutions and services, MiTAC Computing Technology Corp. (MCT) came with design and manufacturing experiences in enterprise servers, storage systems, embedded products and industrial computers for 30 years strong, as well as hyper scale data center implementation proven records. Combining 30 years of history of TYAN server customization capacity, comprehensive relationships with channel and system integration service providers it is now providing customers with deliverables featuring flexibility and customization while aligned with different system and application types.

MCT's Cloud Computing solutions cover the entire spectrum, from rack and tower system, high-performance and GPU-accelerated computing, Cloud Computing servers, storage systems, blade servers, workstations, through to complete systems and cabinets aimed at offering customers and markets the best TCO (Total Cost of Ownership) public, private and hybrid cloud equipment of the next generation; MCT Industrial PC solutions contain panel PC, embedded system , mobile POS, and industrial motherboards to offer brand owners and system integrators with specialty solutions featuring better integration and competitiveness.

www.mitacmct.com

As the world leader in next-generation mobile technologies, Qualcomm ideas and inventions are driving wireless growth and helping to connect people to information, entertainment and one another. Qualcomm’s breakthrough technologies enable the convergence of mobile communications and consumer electronics, making wireless devices and services more personal, affordable and accessible to people everywhere.

In the near future, billions of pieces of equipment will be connected to one another and massive amounts of data will pouring in. Advanced algorithms, high-powered computing, better connectivity and cloud storage all facilitate the emergence of smart systems. Knowing how to leverage the respective opportunities, however, requires a unique set of skills. Siemens has the engineering, domain and digital know-how to generate performance improvements across the entire value chain, from design to production and operations to maintenance. Digital simulation technology accelerates the plant design, the installation and commissioning as well as the entire product design and production planning process. Multiple components in systems and plants can be intelligently networked to communicate with each other and exchange real-time data. Machine Learning makes complex systems more efficient without human intervention. The intelligent analysis of operational data helps identify patterns and predict potential downtimes. Minimum downtimes boost reliability thanks to lifecycle services.

Qualcomm® IoT technologies and solutions utilize the real-world Connected Intelligent Edge to offer end-to-end, ready-to-deploy solutions so customers can digitally transform their businesses to optimize their operations, monetize massive amounts of data, innovate in new ways, and drive cost savings.

Also, Qualcomm 3D Sonic Sensors deliver a better user experience by using technological advances and acoustics (ultrasonic waves) to scan 3D features such as ridges, valleys, as well as pores of a user’s finger for a deeply accurate image. This allows the Qualcomm 3D Sonic Sensor to scan fingerprints through solid surfaces like glass and metal even while wet.

ARUP Laboratories, Digital Realty, University of Michigan, HP, Polar Electro, Electrolux, ROJ Electronics Srl, Tokamak Energy, Grissom High School, Zipline, Bye Aerospace. 

Formula E, OnePlus