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Terepac was founded in 2004 to commercialize breakthrough innovations which over­come these limitations through an entirely new paradigm for assembly, integration and packaging of electronic products. The company’s revolutionary technologies enable sophisticated microelectron­ics to be printed on flexible substrates at a fraction of the size and cost of creating conventional circuits. Entire devices with microprocessors, memory, and sensors can be reduced to less than a millimeter square, thinner than paper, and flexible enough to bend around a pencil – with no sacrifice in performance.